Li Jie, deputy head of Liangjiang's administrative committee, speaks at the 2023 Smart Manufacturing Summit Forum on July 8. [Photo/liangjiang.gov.cn]

The 2023 Smart Manufacturing Summit Forum and the annual meeting of the AI-based Smart Manufacturing Systems TC, Institute of Electrical and Electronics Engineers (IEEE) were held in Liangjiang New Area, Southwest China's Chongqing municipality, on July 8.

Ye Tianchun, an academician from the International Eurasian Academy of Sciences; Wu Hanming, honorary president of the AI-based Smart Manufacturing Systems TC of IEEE, Zhou Mengchu, an academician from the National Academy of Inventors, as well as leaders of the new area, attended the forum.

Li Jie, deputy head of Liangjiang's administrative committee, highlighted the new area as the third national-level development and opening-up zone in China and the first inland one. It is also the main contributor to the development of the electronic information industry in Chongqing.

Currently, the output value of the electronic information industry exceeds 200 billion yuan ($27.8 billion), accounting for one-third of the entire Chongqing. The new area will continue to build a first-class business environment, provide high-quality, efficient, and convenient services, and work with entrepreneurs to seek joint development and create a better future, added Li.

In his speech, Ye Tianchun emphasized the significance of intelligent manufacturing in China, which possesses the world's largest manufacturing industry and the most diverse industrial categories. Intelligent manufacturing is crucial in China's innovation-driven development strategy and transition from high-speed to high-quality development.

The chip industry's advancement is the key to supporting intelligent manufacturing development. It is essential to determine new application demands, redefine application definitions, and establish a new application ecosystem in intelligent manufacturing. Consequently, this must be based on China's existing integrated circuit industry foundation, outlining chip product and standard definitions and restructuring chip product and technical systems to foster a positive feedback loop, according to Ye.